Description
4×4" board.
Requirements: an 750-800 degree F iron and paste flux.
Manufacturer’s part number: 202-0025-01
Video demonstrating hand soldering of a QFN package:
$19.99
For chips that connect using a grid of balls underneath, this board has a grid of vias that the balls fit into and solder can be applied through from the other side.
Out of stock
4×4" board.
Requirements: an 750-800 degree F iron and paste flux.
Manufacturer’s part number: 202-0025-01
Video demonstrating hand soldering of a QFN package:
Weight | 0.1 kg |
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