QFN, or Quad Flat No-Lead, packages (also called Chip Scale) are very difficult to hand solder due to their lack of leads, and typically a heat sink on the bottom. This board has pre-installed solder traces that the chip sits on top of, as well as a via through which the bottom-side heat sink can be soldered. 2×2″ in size. The only requirement is a tip slightly smaller than the lead size and liquid flux. Recommended tip temperature is 750 – 800 degrees F. detailed pdf Manufacturer’s part number: 202-0016-01 Video demonstrating hand soldering of a QFN package:
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